McLantis manufactures world's first class MEMS LDI, laser direct imager MEMS, MEMS semiconductor LDI
1. McLantis laser directing imaging system is designed for tiny line width MEMS.
2. It saves on labor and mask cost for customer.
3. It reduces complexity by removing one process step of mask preparation.
4. The better performance with overlay and CD uniformity control has made the systems the best solution for imaging mass production of HDI and flex applications.
5. McLantis laser directing imaging system can expose the material base up to 630 x 730mm and with the resolution up to 8um.
Model | MAC-DPB-DI10E |
Light Source | Fiber Coupled Laser + DMD |
Laser Power | 24 Watts |
Wave Length | 395nm - 415nm UV sensitive |
Imaging Material | Conventional dry film, sensitive ink, LDI dry film |
Supported Substrate | Max: 630x730mm Min: 250x250mm |
Substrate Thickness | 0.05mm – 5mm |
Minimum Line Width / Line Distance | 8um / 8um |
Line Width Accuracy | Within 4um |
Depth of focus | 300um |
Layer Alignment Accuracy | 4um |
Outer Layer Alignment Accuracy | 4um |
Repeat Accuracy | 2um |
File Format | Gerber274X, Gerber274D, ODB++ |
Productivity (535x610mm, 20 mj/cm2) | 42s / side |
Machine dimension | 2800x1700x1590mm |
Machine Weight | 3500 KG |
