Liquid Photosensitive Circuit Ink
It has a high resolution ratio, excellent adhesion, anti-etching performance and anti-plating performance. After development no need dry with a high temperature, can directly carry out copper plating, tin plating and etc. It's suitable for making precision circuit of double-sided and multilayer plates.
| Model | PCBMAC-LPCI |
|---|---|
| Color | Blue |
| Viscosity(25℃) | 60±10 dPa·s |
| Fineness | ≤5μm |
| Solid content | 60±5% |
| Density(25℃) | 1.1-1.2g/ml |
| Resolution ratio | 50μm(2.0 mil) |
| Adhesion | 100/100 |
| Hardness | ≥2H |
| Etching | Acid or alkali etching solution |
| Pre-drying limit | 75℃,60min |
| Packing | 5.0kg/barrel; 20kg/box |
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Frequently Asked Questions
What are the key specifications of Liquid Photosensitive Circuit Ink?
Color: Blue; Viscosity(25℃): 60±10 dPa·s; Fineness: ≤5μm; Solid content: 60±5%; Density(25℃): 1.1-1.2g/ml; Resolution ratio: 50μm(2.0 mil); Adhesion: 100/100; Hardness: ≥2H; Etching: Acid or alkali etching solution; Pre-drying limit: 75℃,60min; Packing: 5.0kg/barrel; 20kg/box