Liquid Photosensitive Solder Resist Ink
1. The quality of liquid photosensitive solder resist ink is very excellent, suitable for the manufacture of high-end electronic products, the price is moderate.
2. Two-component, screen-printed high-precision alkaline liquid imaging solder resist ink for double-sided and multi-layer printed circuit boards for precision circuits. The flatness is good, and the post-cured coating film has excellent adhesion, chemical resistance and heat resistance.
3. Liquid photosensitive solder resist ink has good printing properties, its density, heat resistance, chemical resistance is extremely excellent, has a wide range of operating conditions, is a very general and easy to operate, highly acceptable ink.
| Model | PCBMAC-SRI |
|---|---|
| Color | green, black, red, white, yellow |
| Viscosity | VT-04F 25℃ |
| Main agent | 280±20PS |
| Curing agent | 70±20PS, main agent/curing agent: 3/1 |
| Fineness | Scraper fineness meter <5um |
| Hardness | Pencil hardness tester>6H |
| Bond constant | 3.2 (1MHZ) |
| Adhesion | 100/100 for 100 grid test 3M tape |
| Solder resistance | Tin furnace 280℃x 10s x 2 times, no blistering, no shedding |
| Insulation resistance | 1.0 x 1012 ohm |
| Storage temperature | 22±4℃ |
| Packaging | main agent 750g, curing agent 250g |
| Validity period | 6 months |
| Light source | LED, metal halide lamp, high pressure sodium lamp, electrodeless lamp |
Frequently Asked Questions
What are the key specifications of Liquid Photosensitive Solder Resist Ink?
Color: green, black, red, white, yellow; Viscosity: VT-04F 25℃; Main agent: 280±20PS; Fineness: Scraper fineness meter <5um; Hardness: Pencil hardness tester>6H; Bond constant: 3.2 (1MHZ); Adhesion: 100/100 for 100 grid test 3M tape; Solder resistance: Tin furnace 280℃x 10s x 2 times, no blistering, no shedding; Insulation resistance: 1.0 x 1012 ohm; Storage temperature: 22±4℃; Packaging: main agent 750g, curing agent 250g; Validity period: 6 months