Laser MEMS
Laser MEMS & Direct Imaging
Sub-micron laser imaging engines
Our Laser MEMS platform integrates micro-electro-mechanical mirrors, high-stability laser sources and real-time beam shaping to deliver sub-micron direct imaging for PCB, screen and advanced packaging. It is the optical heart of every McLantis LDI and CTS system.
Capabilities
- Sub-micron pixel registration
- Multi-wavelength laser sources (405 / 830 nm)
- MEMS mirror array with <1 µm settling
- Closed-loop thermal & focus stabilization
Applications
- Laser Direct Imaging (LDI) for PCB
- Computer-to-Screen (CTS)
- Advanced packaging & IC substrate
- Semiconductor maskless exposure
Key Specifications
Imaging resolutionUp to 5 µm / 10,000 dpi
Registration±1.5 µm
Wavelength405 nm / 830 nm