Ink Resist Solder Photosensitive Liquide

Ink Resist Solder Photosensitive Liquide

1. La qualité de Ink Resist Solder Photosensitive Liquide est très excellent, convient pour la fabrication de high-end electronic products, le price is moderate.

2. Bicomponent, screen-printed high-precision alkaline liquid imaging solder resist ink for double-sided and multilayer printed circuit boards for precision circuits. The flatness is good, and the post-cured coating film has excellent adhesion, chemical resistance, and heat resistance.

3. Photoresist ink for solder mask exhibits excellent printing characteristics, with outstanding density, heat resistance, and chemical resistance. It is suitable for a wide range of operating conditions, making it a highly versatile, user-friendly, and widely accepted ink.

ModèlePCBMAC-SRI
Couleurgreen, black, red, white, yellow
ViscositéVT-04F 25℃
Agent principal280±20PS
Agent de durcissement70±20PS, main agent/curing agent: 3/1
FinesseScraper fineness meter <5um
DuretéPencil hardness tester>6H
Constante de liaison3.2 (1MHZ)
Adhérence100/100 for 100 grid test 3M tape
Résistance à la soudureTin furnace 280℃x 10s x 2 times, no blistering, no shedding
Résistance d'isolation1.0 x 1012 ohm
Température de stockage22±4℃
Emballagemain agent 750g, curing agent 250g
Période de validité6 months
Source lumineuseLED, metal halide lamp, high pressure sodium lamp, electrodeless lamp

Frequently Asked Questions

Quelles sont les spécifications clés de Ink Resist Solder Photosensitive Liquide ?

Couleur: green, black, red, white, yellow; Viscosité: VT-04F 25℃; Agent principal: 280±20PS; Finesse: Scraper fineness meter <5um; Dureté: Pencil hardness tester>6H; Constante de liaison: 3.2 (1MHZ); Adhérence: 100/100 for 100 grid test 3M tape; Résistance à la soudure: Tin furnace 280℃x 10s x 2 times, no blistering, no shedding; Résistance d'isolation: 1.0 x 1012 ohm; Température de stockage: 22±4℃; Emballage: main agent 750g, curing agent 250g; Période de validité: 6 months

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