Laser Direct Imager for MEMS
- McLantis laser directing imaging system is designed for tiny line width MEMS
- It saves on labor and mask cost for customer
- It reduces complexity by removing one process step of mask preparation
- The better performance with overlay and CD uniformity control has made the systems the best solution for imaging mass production of HDI and flex applications
- McLantis laser directing imaging system can expose the material base up to 630 x 730mm and with the resolution up to 8um
| Model | MAC-DPB-DI10E |
|---|---|
| Light Source | Fiber Coupled Laser + DMD |
| Laser Power | 24 Watts |
| Wave Length | 395nm - 415nm UV sensitive |
| Imaging Material | Conventional dry film, sensitive ink, LDI dry film |
| Supported Substrate | Max: 630x730mm Min: 250x250mm |
| Substrate Thickness | 0.05mm – 5mm |
| Minimum Line Width / Line Distance | 8um / 8um |
| Line Width Accuracy | Within 4um |
| Depth of focus | 300um |
| Layer Alignment Accuracy | 4um |
| Outer Layer Alignment Accuracy | 4um |
| Repeat Accuracy | 2um |
| File Format | Gerber274X, Gerber274D, ODB++ |
| Productivity (535x610mm, 20 mj/cm2) | 42s / side |
| Machine dimension | 2800x1700x1590mm |
| Machine Weight | 3500 KG |
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Frequently Asked Questions
What are the key specifications of Laser Direct Imager for MEMS?
Light Source: Fiber Coupled Laser + DMD; Laser Power: 24 Watts; Wave Length: 395nm - 415nm UV sensitive; Imaging Material: Conventional dry film, sensitive ink, LDI dry film; Substrate Thickness: 0.05mm – 5mm; Minimum Line Width / Line Distance: 8um / 8um; Line Width Accuracy: Within 4um; Depth of focus: 300um; Layer Alignment Accuracy: 4um; Outer Layer Alignment Accuracy: 4um; Repeat Accuracy: 2um; File Format: Gerber274X, Gerber274D, ODB++